On November 10-11, the 29th China Integrated Circuit Design Industry 2023 Annual Conference and Guangzhou Integrated Circuit Industry Innovation and Development Summit Forum (ICCAD 2023) was successfully held at Guangzhou Poly World Trade Center Expo, and the Guangzhou debut of ICCAD came to a successful conclusion
With the theme of “Bay Area with You, Core to the Future”, the conference deeply discussed the difficulties and challenges faced by China’s integrated circuit industry, especially the IC design industry, and development suggestions under the current situation, and built a platform for enterprises in all aspects of the integrated circuit industry chain to exchange and cooperate in the fields of technology, market, application, investment, etc., which is of great significance for the development of integrated circuits.
Keynote speech
HISEMI Electronics to “Explore one-stop advanced packaging test fablesee” as the theme report, Huayu Electronics will be based on the semiconductor industry ecological chain, explore the new mode of one-stop advanced packaging test Fabless. It shows the unique sealing test capability and comprehensive advanced sealing test platform development plan of Huayu Electronics.
HISEMI Electronics strives to achieve two-way development in the field of integrated circuit packaging and testing, with the service concept of “quality-oriented, loyal to customers”, with a comprehensive and perfect packaging process, as well as one-stop characteristic services integrating packaging and testing, to provide high-quality packaging and testing technical support for consumer, industrial control, vehicle specification and other products.
At present, the company continues TO develop and expand the DFN/QFN/LQFP/TO series, and has started to develop the LGA/FBGA/Flip Chip and other sealed test shapes.
In the future, HI SEMI Electronics will further focus on the development of more integrated packaging products and provide customers with a more comprehensive and complete sealed test platform.
